美國Harrick Plasma公司台灣獨家代理
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電漿清洗機 O2 Plasma Cleaner

Harrick Plasma 氧電漿機，可作為表面清潔，表面處理和表面改質的優良工具，可以應用於各種材料，包括金屬，陶瓷，複合材料，塑料，聚合物和生物材料等。

Harrick 三十多年前是首批開發Plasma的公司之一。儘管最初設計只用於一般光學元件的表面清潔，但已經在各種的應用和技術領域中得到肯定，至今已被引用超過3000篇評審論文和近150項專利。

Plasma 除了廣泛的應用於表面工程上，包括表面清潔，表面滅菌，表面活化，表面改質，以用於表面貼合處理，表面化學的改質，以及聚合物的表面處理外,生物材料可通過活化，接枝和表面塗層的處理，主要應用領域包括材料科學，微流體學 PDMS，聚合物科學，生物醫學材料，光學，牙科和醫療植入物等。

基本型電漿清洗機
​Basic Plasma Cleaner PDC-32G

具有Low (7W) , Medium (11W), High (18W) 三段功率可調整
​此已固定無法擴充至30W及45W

​一體成型 3" diameter x 6.5" length Pyrex chamber,可擴充為石英材質
​
1/4" swagelok metering valve to qualitatively control gas flow
​1/8" NPT 3-way valve to quickly switch from introducing gas, venting, and isolating the chamber
Weight: 13 lbs (6 Kg)
Size: 8.5" H x 10" W x 8" D

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擴充型電漿清洗機
​Expand Plasma Cleaner PDC-001

具有Low (7W), Medium (11W), High (30W)三段功率可調整
​此已固定無法擴充至45W

​一體成型 6" diameter x 6.5" length Pyrex chamber,可擴充為石英材質

1/4”swagelok metering valve to qualitatively control gas flow
1/8" NPT 3-way valve to quickly switch from introducing gas, venting and isolating the chamber
Weight: 37 lbs (17 Kg)
Size: 11" H x 18" W x 9" D

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高功率擴充型電漿清洗機
​Expand Plasma Cleaner PDC-001HP

具有Low (30W), Medium (38W), High (45W)三段功率可調整


​一體成型 6" diameter x 6.5" length Pyrex chamber,可擴充為石英材質

1/4” swagelok metering valve to qualitatively control gas flow
1/8" NPT 3-way valve to quickly switch from introducing gas, venting and isolating the chamber
Weight: 37 lbs (17 Kg)
Size: 11" H x 18" W x 9" D

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Physics of Plasma
電漿是如何產生的，以及它如何與物質表面相互作用的基礎知識。
Plasma Advantages
利用電漿做表面處理對表面本身的優點，一致性，低成本，易於使用，以及環境安全。
Plasma-Surface Interaction
根據所使用的氣體和材料類型，可能會發生不同的表面作用。
Plasma Process Gases
不同的氣體可用於化學和材料以去除污染，氧化，活化。
主要應用領域：
包括 材料科學，聚合物科學，生物醫學材料，牙科和醫療植入物的滅菌和其儀器，光學清潔和微流體表面的清潔，消毒表面，表面活化，表面的改質，以用於粘結和吸附，PDMS 表面處理，表面改質，以及EcoFlex改質

​Application of Plasma 

​清 洗 生 物 晶 片

生物晶片實驗過後,必須以強酸清洗約30分鐘,才能完全清洗乾淨,改以PDC-32G 氧電漿機通入氧氣後清洗10分鐘後,以接觸角分析,可看到左邊清洗前為28度,清洗後接觸角為0度,證明已完全清洗乾淨                          

​​PDMS Bonding 應用及步驟

HarrickPlasma 原廠應用資源 :
如有各式應用問題，歡迎您來電，將樂於分享文獻及原廠資料及期刊論文等

News & Research :

Conducting Polymers (CP), such as polypyrrole (pPy), are promising materials with potential applications as electrochemical energy storage devices, actuators and biosensors due to their conductivity, redox activity and biocompatibility. Success in these applications depends on the polymer thickness and stability; thicker pPy layers offer increased charge storage capacity while mechanical stability is critical for long term use. Due to poor adhesion between CP and the underlying electrode material, researchers have been unable to achieve high CP performance. To address this, various processing techniques have been attempted to achieve stronger adhesion, including chemical etching to improve mechanical interlocking as well as covalently bonding pyrrole monomers to the electrode. However, these methods tend to degrade the overall stability of CP. To be able to utilize conducting polymers in practical applications, their interfacial adhesion must be improved while retaining their physical and electrochemical performance.
To enhance the interfacial adhesion of polypyrrole with gold electrodes, plasma treatment and an intermediate coating of polyethyleneimine (PEI) was recently shown to be a critical step. In the Scientific Reports article, Sung Yeol Kim’s group at Kyungpook National University attempted to create thicker and stronger pPy by introducing an adhesion enhancing layer between the conducting polymer and the metal electrode. Using Harrick Plasma’s Basic Plasma Cleaner, they removed organic contamination from the electrode surface and introduced polar carbonyl functional groups to facilitate PEI physisorption. Ultimately, they found that plasma treated gold electrodes coated with PEI (PEI-O2 Au) were the optimal substrate for pPy electrodeposition, outperforming both bare gold electrodes and untreated PEI coated electrodes. They proposed that the polar groups on the plasma-treated electrode surface attracted the positively charged pPy, entangling the pPy backbone with PEI and further enhancing adhesion. As a result, they were able to produce stable pPy layers twice as thick as bare electrodes without reducing electrochemical performance.
​Kim KG, Kim SY. “Increase in Interfacial Adhesion and Electrochemical Charge Storage Capacity of Polypyrrole on Au Electrodes Using Polyethyleneimine”. Sci Rep. (2019) 9: 6346.

相 關 應 用 資 料

• Gao J et al. "Ecosystem Fabrication (EcoFAB) Protocols for The Construction of Laboratory Ecosystems Designed to Study Plant-microbe Interactions". J. Vis. Exp. (2018) 134: e57170. VIDEO
  • Minute 3:49-4:30
  • Plasma treat polydimethylsiloxane PDMS and glass prior to bonding to make microfluidic chip to study plant microbe interactions

 

• Norred SE et al. "Sealable Femtoliter Chamber Arrays for Cell-free Biology". J. Vis. Exp. (2015) 97: e52616. VIDEO
  • Minute 5:00-5:40
  • Plasma treat polydimethylsiloxane PDMS and glass prior to bonding to make microfluidic chip.

 

• Py C et al. "Culturing and Electrophysiology of Cells on NRCC Patch-clamp Chips". J. Vis. Exp. (2012) 60: e3288. VIDEO
  • Minute 2:49-3:05
  • Plasma treat patch-clamp chip (silicon chip glued to Plexiglas culture vial) prior to use as microfluidic device for electrophysiological measurements (action potential of cells). Plasma makes the chip surface hydrophilic.